Specifications
WEIGHT / VOLUME
10g
THERMAL CONDUCTIVITY
1.93 W/m·K
OPERATING TEMPERATURE
-30 - 180 °C
COLOR
Silver
Product Description
Our thermal CPU paste improves the effectiveness of CPU coolers by thermally bonding the CPU to the heatsink.
A high quality metallic solution that helps to ensure maximum dissipation of heat generated by the CPU for optimized performance and greater system stability; and is more effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage.
Please see our support section for the Material Safety Data Sheet for SILVGREASE1. The StarTech.com Advantage - Better thermal conductivity over standard silicon-based compounds and negligible electrical conductivity for effective and safe use in high performance applications